About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology. Our manufacturing platform enables cutting-edge advanced packaging by combining patterning and metallization into a single tool. We deliver high-speed, high-resolution metallization at significantly lower cost and energy use, while reducing emissions and waste.
Join an innovative Australian startup poised to revolutionise advanced packaging in the semiconductor industry.
About the Role
Syenta is seeking a highly technical and execution-focused Process Development Team (PDT) Lead to develop and optimise materials and surface processes enabling our LEM technology.
This role focuses on materials process development, surface treatment, contamination control, defect characterisation, and yield engineering within advanced semiconductor packaging. The successful candidate will establish materials characterisation and inspection methodologies, develop structured frameworks for materials-driven defect analysis, and drive process optimisation and yield improvement through deep understanding of materials behaviour and surface interactions.
Responsibilities
Requirements
Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Engineering, Chemistry, Chemical Engineering, or related field
Preferred Qualifications
Why Choose Syenta?
We’re passionate about building a diverse, people-first company. We believe that a culture of collaboration and mutual respect fuels innovation capable of redefining an industry.
What We Offer
Salary Range: AUD $140k – $160k+ (negotiable)
Equity: ESOP options available
If you’re excited to take on this challenge in advanced packaging development, we want to hear from you — even if you don’t tick every box.
Apply here or send your CV and a short note to careers@syenta.com for more information.